Heliotis 3D Industrial Camera
heliInspect H6
heliInspectTM H6 - Industrial White-Light Interferometer
The heliInspetTM H6 has been engineered to meet thespecifications of the most demanding 3D in-line inspectiontasks such as measuring.
- step heights, angles, shape
- roughness, ripple, waviness
- defects, scratches, wear off
- flatness, coplanarity, deformations
- film thickness (tomographic mode)
For Equipment Manufactures Equipment manufacturers benefit from the modular architecture of the H6 platform, access to sophisticated firmware features, software development kits and Heliotis’ design-in expertise. The standard capabilities may be extended by custom features (e.g. optics,CMOS image sensor, electronics, FPGA, software,mechanics).
| Measurement head | industrial White-Light Interferometer compatible with exchangeable heliOptics™ WLI6 interferometer modules |
| Acquisition device | custom high-speed CMOS sensor with in-pixel signal processing |
| Light source | integrated high power LED (standard) or SLED (optional) |
| Dimensions (L x W x H) | 147 mm x 75 mm x 45 mm |
| Weight | 800 g (excluding WLI6) |
| Software | software development kits (SDK) for Halcon, LabView, C++, Python |
heliOptics™ WLI6
| Interferometer | Mirau | Mirau | Mirau | Michelson | Michelson | Michelson |
| field of view | 232 x 222 μm2 |
580 x 556 μm2 |
1.16 x 1.11 mm2 |
1.47 x 1.41 mm2 |
2.93 x 2.81 mm2 |
5.86 x 5.62 mm2 |
| working distance | 2.52 mm | 3.57 mm | 3.57 mm | 14.1 mm | 55.8 mm | 56.6 mm |
| WLI module | MIRAU-X50 | MIRAU-X20 | MIRAU-X10 | TG-R5 | TG-R10 | TG-R20 |
| numerical aperture | 0.5 | 0.4 | 0.3 | 0.17 | 0.11 | 0.07 |
| lateral resolution | 0.8 μm | 2 μm | 4 μm | 5 μm | 10 μm | 20 μm |
| resolution RMS (phase mode) |
50 nm (1 nm) |
70 nm (1 nm) |
100 nm (1 nm) |
100 nm (2 nm) |
100 nm (2 nm) |
100 nm (2 nm) |
| repeatability | 100 nm (2 nm in phase mode) | 100 nm (5 nm in phase mode) | ||||
| reflectivity of sample | < 0.1% to 100% | |||||